5962-9461113HAA 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
From Micross Components, Inc.
| Status | ACTIVE | 
| Access Time-Max (tACC) | 35 ns | 
| Memory Density | 1.68E7 deg | 
| Memory IC Type | MULTI DEVICE SRAM MODULE | 
| Memory Width | 32 | 
| Mfr Package Description | CERAMIC, QFP-68 | 
| Number of Functions | 1 | 
| Number of Terminals | 68 | 
| Number of Words | 524288 words | 
| Number of Words Code | 512K | 
| Operating Mode | ASYNCHRONOUS | 
| Operating Temperature-Max | 125 Cel | 
| Operating Temperature-Min | -55 Cel | 
| Organization | 512K X 32 | 
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | 
| Package Shape | SQUARE | 
| Package Style | FLATPACK | 
| Parallel/Serial | PARALLEL | 
| Supply Voltage-Max (Vsup) | 5.5 V | 
| Supply Voltage-Min (Vsup) | 4.5 V | 
| Supply Voltage-Nom (Vsup) | 5 V | 
| Surface Mount | Yes | 
| Technology | CMOS | 
| Temperature Grade | MILITARY | 
| Terminal Finish | TIN LEAD | 
| Terminal Form | GULL WING | 
| Terminal Pitch | 1.27 mm | 
| Terminal Position | QUAD | 



